Title:
HEAT MEDIUM TEMPERATURE ADJUSTMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/270593
Kind Code:
A1
Abstract:
The present invention enables the temperature of a plurality of objects to be temperature-adjusted to be adjusted by a heat medium even in the event of a system malfunction. This heat medium temperature adjustment system comprises a heat medium circuit that circulates a heat medium temperature-adjusted by heat exchange with a heat source. The heat medium circuit is equipped with a pump that pumps the heat medium and a plurality of heat exchangers for objects to be temperature-adjusted which exchange heat between the heat medium and the objects to be temperature-adjusted. In the event of a system malfunction, the heat medium circuit forms a series flow path that connects the pump to the plurality of heat exchangers for objects to be temperature-adjusted.
Inventors:
SHIMIZU NOBUTAKA (JP)
TAKAZAWA OSAMU (JP)
MIYAKOSHI RYO (JP)
IWAZAKI WATARU (JP)
SATO MASAAKI (JP)
TAKAZAWA OSAMU (JP)
MIYAKOSHI RYO (JP)
IWAZAKI WATARU (JP)
SATO MASAAKI (JP)
Application Number:
PCT/JP2022/025152
Publication Date:
December 29, 2022
Filing Date:
June 23, 2022
Export Citation:
Assignee:
SANDEN ADVANCED TECH CORPORATION (JP)
International Classes:
F25B1/00; B60H1/00; F24F11/32; F24F11/85; F25B29/00
Foreign References:
| JP2016097745A | 2016-05-30 | |||
| JP2018080865A | 2018-05-24 | |||
| JP2017044377A | 2017-03-02 | |||
| JP2016199203A | 2016-12-01 |
Attorney, Agent or Firm:
EBISU INTERNATIONAL PATENT OFFICE (JP)
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