Title:
HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO2002038691
Kind Code:
A3
Abstract:
A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adhered, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 mu m, and has a convex portion resulting from the thermo-expandable microspheres.
Inventors:
MURATA AKIHISA (JP)
OSHIMA TOSHIYUKI (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
OSHIMA TOSHIYUKI (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
Application Number:
PCT/JP2001/009743
Publication Date:
September 26, 2002
Filing Date:
November 07, 2001
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
MURATA AKIHISA (JP)
OSHIMA TOSHIYUKI (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
MURATA AKIHISA (JP)
OSHIMA TOSHIYUKI (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
International Classes:
C09J5/00; C09J7/22; C09J7/38; C09J11/00; C09J201/00; (IPC1-7): C09J7/02
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30)
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