Title:
HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD OF PROCESSING ADHEREND WITH THE HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2005/087887
Kind Code:
A1
Abstract:
A heat-peelable pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer can be prevented from being deformed by pressing in a pressing step and which, after processing, enables the processed work to be easily separated therefrom. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a heat-expandable pressure-sensitive adhesive layer containing a blowing agent, and is characterized in that the heat-expandable pressure-sensitive adhesive layer in an unfoamed state has a modulus in shear (23°C) of 7×106 Pa or higher. The heat-expandable pressure-sensitive adhesive layer in an unfoamed state preferably has a modulus in shear (95°C) lower than 7×106 Pa. Furthermore, the blowing agent contained in the heat-expandable pressure-sensitive adhesive layer preferably has a blowing initiation temperature exceeding 80°C.
Inventors:
ARIMITSU YUKIO (JP)
MURATA AKIHISA (JP)
KISHIMOTO TOMOKO (JP)
MURATA AKIHISA (JP)
KISHIMOTO TOMOKO (JP)
Application Number:
PCT/JP2005/003067
Publication Date:
September 22, 2005
Filing Date:
February 18, 2005
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
ARIMITSU YUKIO (JP)
MURATA AKIHISA (JP)
KISHIMOTO TOMOKO (JP)
ARIMITSU YUKIO (JP)
MURATA AKIHISA (JP)
KISHIMOTO TOMOKO (JP)
International Classes:
C09J5/00; C09J5/08; C09J7/22; C09J7/38; C09J201/00; H01G4/12; H01G13/00; H01L21/68; H01L21/78; (IPC1-7): C09J7/02; C09J5/00; C09J201/00; H01L21/78; H01G4/12; H01G13/00
Foreign References:
| JP2003064329A | 2003-03-05 | |||
| JP2002121510A | 2002-04-26 |
Other References:
See also references of EP 1724319A4
Attorney, Agent or Firm:
Goto, Yukihisa (7-16 Higashitenma 2-chome, Kita-k, Osaka-shi Osaka 44, JP)
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