Title:
HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR MANUFACTURING MULTI-LAYER CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2018/008791
Kind Code:
A1
Abstract:
The present invention relates to a heat-peelable pressure-sensitive adhesive sheet for manufacturing a multi-layer ceramic capacitor, characterized such that when a multi-layer ceramic capacitor is manufactured, a multi-layer ceramic capacitor bar is fixed to a pressure-sensitive adhesive sheet, cut-processed into a chip size, and then heated so as to enable a multi-layer ceramic capacitor chip, which is an adherend, to be easily peeled from the pressure-sensitive adhesive sheet. The heat-peelable pressure-sensitive adhesive sheet for manufacturing a multi-layer ceramic capacitor, according to the present invention, has a dual structure in which a pressure-sensitive adhesive layer comprises a first pressure-sensitive adhesive layer and a second foam pressure-sensitive adhesive layer, and after heat-foaming is performed through the adjustment of compressive strain by applying an inorganic filler to the first pressure-sensitive adhesive layer, the surface of the adhesive sheet is uniform and smooth, over-foaming of some foam cells is prevented, and a blade is prevented from being stained with a pressure-sensitive adhesive when the multi-layer ceramic capacitor bar is cut into a chip size. In addition, a slip phenomenon of a chip is prevented by implementing a high pressure-sensitive adhesive force at a high temperature of 80-85°C by the second foam pressure-sensitive adhesive layer when the chip is cut, a peeling force of the chip, which is an adherend, is improved after foaming by ensuring a dispersion degree and dispersion stability of a foaming agent, and residues are prevented from contaminating the adherend after foaming.
Inventors:
LEE DONG HO (KR)
SEO YOUNG OK (KR)
SEO YOUNG OK (KR)
Application Number:
PCT/KR2016/007756
Publication Date:
January 11, 2018
Filing Date:
July 15, 2016
Export Citation:
Assignee:
FINE TECH CO LTD (KR)
International Classes:
C09J11/04; H01G4/30
Foreign References:
| JP2007069380A | 2007-03-22 | |||
| JP2009120807A | 2009-06-04 | |||
| KR20140109293A | 2014-09-15 | |||
| KR20100096031A | 2010-09-01 | |||
| KR20130036717A | 2013-04-12 |
Attorney, Agent or Firm:
STY PATENT LAW FIRM (KR)
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