HEAT PIPE BASED COOLING SYSTEM AND POWER EQUIPMENT

WIPO Patent Application WO/2017/066993

A1

The present invention provides a heat pipe based cooling system, comprising a first pipeline (10) and a second pipeline (20). The first pipeline (10) comprises a first steam pipe (12), a first liquid pipe (14), and an evaporation section (16) connected between the first steam pipe (12) and the first liquid pipe (14). The second pipeline (20) comprises a second steam pipe (22), a second liquid pipe (24), and a transducer (26) connected between the second steam pipe (22) and the second liquid pipe (24). Two sets of quick joints (30) are respectively connected between the first steam pipe (12) and the second steam pipe (22) and between the first liquid pipe (14) and the second liquid pipe (24), such that the first pipeline (10) and the second pipeline (20) are combined to form a loop heat pipe. The loop heat pipe comprises a valve (40) for vacuum pumping and an interface (42). A refrigeration working medium is provided within the loop heat pipe, and a capillary structure is provided within the evaporation section (16) to provide a capillary suction force so that the refrigeration working medium circulates in the loop heat pipe. The present invention has the advantages of high heat transfer efficiency and good reliability, and having no risk of working medium leakage. The present invention also provides power equipment.

PENG YAOFENG (CN)
LI ZHIJIAN (CN)
LIU HONGHUI (CN)
CHI SHANJIU (CN)

PCT/CN2015/092689

April 27, 2017

October 23, 2015

Click for automatic bibliography generation  

HUAWEI TECH CO LTD (CN)

H05K7/20

CN104735959A	2015-06-24
CN104534600A	2015-04-22
CN203120357U	2013-08-07
CN102883581A	2013-01-16

See also references of EP 3193571A4
None

GUANGZHOU SCIHEAD PATENT AGENT CO., LTD (CN)

View/Download PDF      PDF Help

Previous Patent: HEAD-MOUNTED DISPLAY DEVICE, AND PROMPT INFORMATION DISPLAY SYSTEM AND METHOD

Next Patent: METHOD AND DEVICE FOR VERIFYING ACCESS TO SERVER