Title:
HEAT PIPE TYPE COOLING DEVICE, METHOD OF PRODUCING THE SAME AND COOLING PLATE FOR HEAT PIPE TYPE COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/1999/039145
Kind Code:
A1
Abstract:
A heat pipe type cooling device capable of efficiently cooling a cooling plate according to heat reception comprises a cooling plate (3) of which one side is a heat receiving surface and of which the other side is a heat dissipating surface and a heat pipe (10) buried in the cooling plate (3). A plurality of heat dissipating fins are provided on the heat dissipating surface.
Inventors:
HASEGAWA MITSUYOSHI (JP)
TAKASAKI TOSHIO (JP)
KONDO HISASHI (JP)
SUZUKI OSAMU (JP)
HARA YASUHIRO (JP)
TAKASAKI TOSHIO (JP)
KONDO HISASHI (JP)
SUZUKI OSAMU (JP)
HARA YASUHIRO (JP)
Application Number:
PCT/JP1998/000395
Publication Date:
August 05, 1999
Filing Date:
January 30, 1998
Export Citation:
Assignee:
HITACHI LTD (JP)
HASEGAWA MITSUYOSHI (JP)
TAKASAKI TOSHIO (JP)
KONDO HISASHI (JP)
SUZUKI OSAMU (JP)
HARA YASUHIRO (JP)
HASEGAWA MITSUYOSHI (JP)
TAKASAKI TOSHIO (JP)
KONDO HISASHI (JP)
SUZUKI OSAMU (JP)
HARA YASUHIRO (JP)
International Classes:
F28D15/02; (IPC1-7): F28D15/02
Foreign References:
| JPH0536897U | 1993-05-18 | |||
| JPS599495A | 1984-01-18 | |||
| JPH07169889A | 1995-07-04 | |||
| JPS57104181U | 1982-06-26 |
Attorney, Agent or Firm:
Ogawa, Katsuo (5-1, Marunouchi 1-chom, Chiyoda-ku Tokyo 100, JP)
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