HEAT PROCESSING DEVICE - YOKOTA TECHNICA LTD COMPANY

Title:

HEAT PROCESSING DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/099886

Kind Code:

A1

Abstract:

A reflow furnace (1) has a depressurization chamber (5), and bubbles contained in molten solder on a substrate (7) are removed in the depressurization chamber (5). The substrate (7), which is supported by a first transportation rail (8), is delivered into the depressurization chamber (5) by a first transportation rod (18). The substrate (7) in the depressurization chamber (5) is extracted by a second transportation rod (32), and transported to the exit of the reflow furnace (1) while being supported by a second transportation rail (9). The width of the first transportation rail (8) and the width of the second transportation rail (9) are adjusted prior to processing a substrate (7) having a different width dimension. When this adjustment is performed, the second transportation rod (32) is displaced in the width direction of the substrate (7) in a state in which the second transportation rod (32) is intruding in the depressurization chamber (5), and the spacing between left and right rail parts (12a, 12a) in the depressurization chamber (5) is adjusted at the same time.

Inventors:

YOKOTA YATSUHARU (JP)

Application Number:

PCT/JP2012/083532

Publication Date:

July 04, 2013

Filing Date:

December 25, 2012

Export Citation:

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Assignee:

YOKOTA TECHNICA LTD COMPANY (JP)

International Classes:

H05K3/34; B23K1/008; H05K13/02; B23K101/42

Foreign References:

JP2008010586A	2008-01-17
JPH01228734A	1989-09-12
JPS63178595A	1988-07-22
JPS63154524U	1988-10-11
JP2000188467A	2000-07-04
JP2011171714A	2011-09-01
JP2000188467A	2000-07-04
JP2011171714A	2011-09-01

Other References: