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Title:
HEAT PUMP APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/203514
Kind Code:
A1
Abstract:
This heat pump apparatus has: a compressor (4) for compressing a refrigerant; a plate heat exchanger (5) which enables heat exchange between the refrigerant and a heat medium, and which is furnished with a refrigerant inlet (5a), a refrigerant outlet (5b), a heat medium inlet (5c), and a heat medium outlet (5d); a pressure reducer (6) for reducing the pressure of the refrigerant; and an evaporator (7) which enables heat exchange between the refrigerant and air. The refrigerant inlet (5a) faces in the same direction as the refrigerant outlet (5b), while the heat medium inlet (5c) faces in the opposite direction from the heat medium outlet (5d) and is provided at a different height from the heat medium outlet (5d). According to the present invention, the flow rate distribution of the heat medium flowing through the interior of the plate heat exchanger (5) is uniform. Since heat exchange takes place throughout the entire plate heat exchanger (5), the heat exchange efficiency of the plate heat exchanger (5) is improved.

Inventors:
NAKATANI KAZUHITO
ISAYAMA YASUHIKO
AOYAMA SHIGEO
Application Number:
PCT/JP2014/003188
Publication Date:
December 24, 2014
Filing Date:
June 16, 2014
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
F24H9/00; F24H1/00; F25B1/00; F25B39/00; F28D9/02; F28F3/08
Foreign References:
JP2001141312A2001-05-25
JP2009180401A2009-08-13
JP2002031407A2002-01-31
JP2006234350A2006-09-07
JP2007271156A2007-10-18
JP2014114983A2014-06-26
JP2008298311A2008-12-11
JP2006258368A2006-09-28
JP2008196777A2008-08-28
Other References:
See also references of EP 3012551A4
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
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