Title:
HEAT PUMP APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/117141
Kind Code:
A1
Abstract:
This heat pump apparatus is provided with a refrigerant circuit having: a compressor that compresses a refrigerant; a heating heat exchanger that exchanges heat between a heat medium and a high-pressure refrigerant compressed by the compressor; a pressure reduction device that reduces the pressure of the high-pressure refrigerant downstream of the heating heat exchanger; an evaporator that evaporates the low-pressure refrigerant reduced in pressure by the pressure reduction device; and a refrigerant piping for connecting the compressor, the heating heat exchanger, the pressure reduction device, and the evaporator. The refrigerant piping has wound piping disposed so as to be wound on the outer periphery of the compressor. The compressor is configured to support the weight of the wound piping.
Inventors:
KOIDE TORU (JP)
MOTEGI SHUJI (JP)
MOTEGI SHUJI (JP)
Application Number:
PCT/JP2019/048324
Publication Date:
June 17, 2021
Filing Date:
December 10, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00
Domestic Patent References:
| WO2013045363A1 | 2013-04-04 |
Foreign References:
| JPS611958A | 1986-01-07 | |||
| JP2003139416A | 2003-05-14 | |||
| JP2004239506A | 2004-08-26 | |||
| JP2003279172A | 2003-10-02 | |||
| JP2008116153A | 2008-05-22 | |||
| JP2000274842A | 2000-10-06 | |||
| CN107965942A | 2018-04-27 | |||
| CN2888362Y | 2007-04-11 | |||
| JP2005146987A | 2005-06-09 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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