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Patent Searching and Data


Title:
HEAT PUMP CYCLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070703
Kind Code:
A1
Abstract:
This heat pump cycle device comprises: a compressor (11); an upstream-side branching portion (12a) that is discharged from a discharge port (11c) of the compressor (11); a heating portion (13, 30) for heating a heating target object using, as a heat source, one high-pressure refrigerant that has been branched at the upstream-side branching portion (12a); a high-stage pressure-reducing portion (14c); a hot-gas gas-liquid separating portion (15b); low-stage pressure-reducing portions (14d, 14e); a bypass passage (21f) allowing the other high-pressure refrigerant that has branched at the upstream-side branching portion (12a) to flow; a bypass-side flow rate regulating portion (14f); and merging portions (12g, 12h). When in a multi-stage hot gas heating mode for heating the heating target object using the heating portion (13, 30), gas phase refrigerant separated by the hot-gas gas-liquid separating portion (15b) is guided to an intermediate pressure suction inlet port (11b) side of the compressor (11), and refrigerant flowing out from the merging portions (12g, 12h) is guided to a low pressure suction inlet port (11a) side of the compressor (11).

Inventors:
HASEGAWA HIROYA (JP)
MIEDA HIROSHI (JP)
OTA KIYOSHIRO (JP)
Application Number:
PCT/JP2023/033393
Publication Date:
April 04, 2024
Filing Date:
September 13, 2023
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
F25B1/00; B60H1/22; F25B13/00; F25B43/00
Domestic Patent References:
WO2013145537A12013-10-03
Foreign References:
JP2021156567A2021-10-07
JP2015137779A2015-07-30
JP2020176824A2020-10-29
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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