Title:
HEAT PUMP DEVICE AND HEAT PUMP WATER HEATER
Document Type and Number:
WIPO Patent Application WO/2021/117184
Kind Code:
A1
Abstract:
Provided is a heat pump device capable of suppressing a reduction in the heating capacity of a compressor when there is no need to reduce the heating capacity of the compressor when the temperature of the water flowing into a heat exchanger rises, due to the temperature of the water flowing out of the heat exchanger being relatively low. The heat pump device (10) according to the present invention comprises: a compressor (11) that compresses a refrigerant; a heat exchanger (12) that exchanges heat between the refrigerant compressed by the compressor (11) and a heat medium; a pressure-reducing device (13) that reduces the pressure of the refrigerant; an evaporator (14) that exchanges heat between the refrigerant subjected to pressure reduction by the pressure-reducing device (13) and outside air; and a control device (15) that reduces the rotational speed of the compressor (11) when the value obtained from inflow temperature, which is the temperature of the heat medium flowing into the heat exchanger (12), and outflow temperature, which is the temperature of the heat medium flowing out of the heat exchanger, reaches a preset value.
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Inventors:
SATO YUSUKE (JP)
HIROSAKI HIROKI (JP)
HIROSAKI HIROKI (JP)
Application Number:
PCT/JP2019/048662
Publication Date:
June 17, 2021
Filing Date:
December 12, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F24H4/02; F25B30/02; F25B1/00
Foreign References:
| JP2018063094A | 2018-04-19 | |||
| JP2010071603A | 2010-04-02 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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