Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/180030
Kind Code:
A1
Abstract:
With respect to a heat medium heat exchanger equipped with flow paths for which there is one heat medium per two cooling mediums, the objective of the present invention is to provide a configuration whereby the efficiency is not reduced when one of the cooling mediums does not contribute to the heat exchange. This heat pump device is configured so as to include two coolant circuits with a cascade heat exchanger therebetween, and a heat medium circuit with which a heat medium exchanges heat with the cooling mediums in these cooling circuits using one heat medium heat exchanger (40). The heat medium heat exchanger (40) is constructed such that a first inner pipe (42) and a second inner pipe (43) are housed in an outer pipe (41), and the inner pipes (42, 43), which circulate the cooling mediums, are assembled so as to enable the transfer of heat with respect to each other without involving the heat medium.
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Inventors:
ISHII SYOU (JP)
Application Number:
PCT/JP2013/064477
Publication Date:
December 05, 2013
Filing Date:
May 24, 2013
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
F25B7/00; F28D7/00; F28D7/02; F28D7/10
Foreign References:
| JP2007139284A | 2007-06-07 | |||
| JP2007178091A | 2007-07-12 |
Attorney, Agent or Firm:
SASAJIMA, Fujio et al. (JP)
Sasajima Wealth 2 male (JP)
Sasajima Wealth 2 male (JP)
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