Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/203493
Kind Code:
A1
Abstract:
This heat pump device (1a) comprises: a refrigerant circuit having a compressor, an expansion valve, and an air heat exchanger; a fan for blowing air to the air heat exchanger; a sound insulation plate that demarcates a machine chamber in which the compressor is installed and an air blowing chamber in which the fan is installed; a housing (29) that covers the machine chamber and the air blowing chamber; and a power source connection section (16) that is provided inside the housing (29), and connects the compressor and electrical wiring for supplying power to the compressor. The housing (29) has an open section (21a) provided with a detachable cover (22a). The power source connection section (16) is provided so as to be serviceable from the outside of the housing (29) when the cover (22a) is removed. According to the present invention, when the cover (22a) is removed, the power source connection section (16) can be easily seen from outside the heat pump device (1a) and serviced, thus making it easier to perform a maintenance check on the heat pump device (1a).
Inventors:
NOMURA MASAKAZU
MIHARA HIROSHI
MIHARA HIROSHI
Application Number:
PCT/JP2014/003078
Publication Date:
December 24, 2014
Filing Date:
June 10, 2014
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
F24F1/22
Foreign References:
| JPH05203198A | 1993-08-10 | |||
| JPH04236031A | 1992-08-25 | |||
| JPS5618868U | 1981-02-19 | |||
| JP2005180725A | 2005-07-07 | |||
| JP2003254563A | 2003-09-10 | |||
| JP2008196777A | 2008-08-28 |
Other References:
See also references of EP 3012542A4
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
Fujii Kentaro (JP)
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