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Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/083392
Kind Code:
A1
Abstract:
A heat pump device (1) having: a refrigerant circuit (8), in which a refrigerant circulates, and which is formed by connecting, by means of piping, a compressor (2), a first heat exchange unit (4), an expansion device (6), and a second heat exchanger (7); and a control unit (21), which controls the operation of the refrigerant circuit (8). In this heat pump device (1) the first heat exchange unit (4) has multiple heat exchange sub-units connected in series, and an expansion sub-device (43) provided between the multiple heat exchange sub-units. In addition, the control unit (21) has a defrosting control means (22) that controls the expansion sub-device (43) when the heat exchange sub-units are defrosted, so as to generate a difference between the pressure of the refrigerant circulating on the upstream side of the expansion sub-device (43) and the pressure of the refrigerant circulating on the downstream side of the expansion sub-device (43).

Inventors:
FUJITSUKA MASASHI (JP)
TSUCHINO KAZUNORI (JP)
Application Number:
PCT/JP2014/067592
Publication Date:
June 11, 2015
Filing Date:
July 01, 2014
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B47/02; F25B1/00; F25B41/00; F25B41/04
Domestic Patent References:
WO1997041398A11997-11-06
Foreign References:
JP2005069673A2005-03-17
JPH10205933A1998-08-04
JP2011080741A2011-04-21
JP2006234375A2006-09-07
JPS5747176A1982-03-17
JP2004176980A2004-06-24
JP2000274780A2000-10-06
JPS62149761U1987-09-22
JPS58178176A1983-10-19
JPS5726376A1982-02-12
US4722388A1988-02-02
DE102005018125A12006-10-26
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
Patent business corporation きさ patent trademark office (JP)
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