Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/140827
Kind Code:
A1
Abstract:
The purpose of the present invention is to inexpensively provide a heat pump device in which HFO-1123 circulates. This heat pump device in which a refrigerant circulates between an indoor unit and an outdoor unit is characterized in that: the refrigerant is a refrigerant mixture of HFO-1123 and an HFC series refrigerant that is not HFO-1123; the cooling capacity (kW) of the outdoor unit is 2.2 kW - 9.5 kW inclusive; the outer diameter (φ) (mm) of a gas pipe connecting the indoor unit and the outdoor unit and the cooling capacity (kW) of the outdoor unit satisfy a relational expression (1.00 ≤ gas pipe outer diameter (φ) (mm) / outdoor unit cooling capacity (kW) ≤ 5.77); and the outer diameter (φ) (mm) of a fluid pipe connecting the indoor unit and the outdoor unit and the cooling capacity (kW) of the outdoor unit satisfy a relational expression (0.67 ≤ fluid pipe outer diameter (φ) (mm) / outdoor unit cooling capacity (kW) ≤ 5.77).
Inventors:
HORIIKE SHINYA (JP)
MORIMOTO HIROYUKI (JP)
SATA HIROSHI (JP)
MORIMOTO HIROYUKI (JP)
SATA HIROSHI (JP)
Application Number:
PCT/JP2014/001483
Publication Date:
September 24, 2015
Filing Date:
March 17, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00; C09K5/04
Domestic Patent References:
| WO2012157764A1 | 2012-11-22 |
Foreign References:
| JP2013200090A | 2013-10-03 | |||
| JP2001248941A | 2001-09-14 | |||
| JPH10122704A | 1998-05-15 | |||
| JP2012131994A | 2012-07-12 |
Attorney, Agent or Firm:
TAKAHASHI, Shogo et al. (JP)
Shogo Takahashi (JP)
Shogo Takahashi (JP)
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