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Patent Searching and Data


Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/190144
Kind Code:
A1
Abstract:
Provided is a heat pump device which, if there is a leak of a combustible refrigerant, is capable of suppressing the formation of a combustible concentration region within a chamber. A heat pump device (1000) comprises a refrigerant circuit (110) that circulates a combustible refrigerant, and a load unit (200) that is disposed within a chamber and accommodates a load-side heat exchanger (2). The load-side heat exchanger (2) performs heat exchange between the combustible refrigerant and a liquid heating medium. The load unit (200) comprises a blower (235), a suction port (231) for sucking in air from the chamber, and a blowout port (232) that is provided at a different height position from the suction port (231) and blows the air sucked in through the suction port (231) into the chamber.

Inventors:
SUZUKI, Yasuhiro (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2015/057433
Publication Date:
December 17, 2015
Filing Date:
March 13, 2015
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F25B1/00; F24D3/00; F24D3/16; F24H1/00
Domestic Patent References:
WO2013038704A12013-03-21
Foreign References:
JP2011075178A2011-04-14
JP2006138582A2006-06-01
JPH1137619A1999-02-12
JP2005016874A2005-01-20
JP2007120772A2007-05-17
JP2010144965A2010-07-01
Other References:
See also references of EP 3156741A4
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (East 8F, TORANOMON TWIN BLDG. 10-1 Toranomon 2-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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