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Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/006387
Kind Code:
A1
Abstract:
This heat pump device 1 is provided with a compression mechanism for compressing a coolant, a motor for driving the compression mechanism, a shell 31 for housing the compression mechanism and the motor, a discharge muffler 2 disposed outside of the shell 31, a first tube for connecting the compression mechanism to the discharge muffler 2, and thermal insulation (a first thermal insulation substance 15 and a second insulation substance 17). The shell 31 and the discharge muffler 2 are positioned adjacent to each other in space but without contacting each other. At least part of the thermal insulation is positioned in space so as to minimize the distance between the outer surface of the shell 31 and the outer surface of the discharge muffler 2.

Inventors:
TAKAYAMA, Keisuke (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
TACHIBANA, Hiroyuki (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
KOIDE, Toru (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2015/069275
Publication Date:
January 12, 2017
Filing Date:
July 03, 2015
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F25B31/02; F04B39/00; F04B39/06; F04C29/06; F25B1/00; F25B41/00
Domestic Patent References:
WO2014083673A12014-06-05
Foreign References:
JP2010223190A2010-10-07
JP2003166472A2003-06-13
JPH09196514A1997-07-31
JP2009008363A2009-01-15
JP2012107791A2012-06-07
JP2005221088A2005-08-18
JP2013096674A2013-05-20
JPS629154A1987-01-17
JPH0267823U1990-05-23
JPS4834957U1973-04-26
JP2008175066A2008-07-31
Other References:
See also references of EP 3318821A4
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (Takada, Takahashi & Partners Konwa Bldg. 7F, 12-22 Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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