HEAT PUMP DEVICE - MITSUBISHI ELECTRIC CORP

Title:

HEAT PUMP DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/037544

Kind Code:

A1

Abstract:

Provided is a heat pump device that can discharge air from a heating medium circuit regardless of the height of the positions of two housings and that can prevent refrigerant from flowing into a housing not accommodating a liquid heat exchanger when refrigerant penetrates into the heating medium circuit in the liquid heat exchanger. In order to accomplish this, a heat pump device is provided with: refrigerant piping that connects a compressor, a pressure reducing device, an air heat exchanger, and a liquid heat exchanger in a ring; heating medium piping that connects the liquid heat exchanger and a pump in a ring; a first and a second air vent valve that can discharge air inside the heating medium piping to the outside; a first housing that accommodates the compressor, the pressure reducing device, the air heat exchanger, the liquid heat exchanger, the refrigerant piping, and the first air vent valve therein; and a second housing that accommodates the second air vent valve therein. The pump causes the liquid heating medium to flow in the heating medium piping in a preset circulation direction, and the liquid heat exchanger, the first air vent valve, and the second air vent valve are disposed in order in the circulation direction.

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Inventors:

KAWASHIMA MITSURU (JP)

Application Number:

PCT/JP2016/074876

Publication Date:

March 01, 2018

Filing Date:

August 25, 2016

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

F25B1/00; F24D3/18; F24F5/00; F24H4/00; F25D17/02

Foreign References:

JP2013167398A	2013-08-29
JP2016085029A	2016-05-19
JP2013257079A	2013-12-26
JP2000104940A	2000-04-11
JP2010190466A	2010-09-02
JP2000230732A	2000-08-22

Other References: