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Patent Searching and Data


Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/179056
Kind Code:
A1
Abstract:
This heat pump device has: a first heat exchanger that exchanges heat between a refrigerant and air; an air blower that blows air to the first heat exchanger; a second heat exchanger that exchanges heat between the refrigerant and a heat medium; and a storing container that stores the second heat exchanger. The first heat exchanger is disposed along a rear surface in a housing. The storing container is disposed on a bottom plate of the housing such that the storing container faces the first heat exchanger via a gap. The air blower is disposed above the storing container. The heat pump device is provided with: a blocking member, which is configured to cover the upper surface of the gap between the storing container and the first heat exchanger, and which forms, in the gap, an internal air flow channel partitioned from a space where the air blower is disposed; and a communication section that communicates the internal air flow channel and an external space to each other.

Inventors:
MOTEGI, Shuji (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2017/012401
Publication Date:
October 04, 2018
Filing Date:
March 27, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F25B30/02; F24F1/48
Domestic Patent References:
WO2015045114A12015-04-02
Foreign References:
JP2008145003A2008-06-26
JP2011094896A2011-05-12
JP2011064384A2011-03-31
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (Takada, Takahashi & Partners Konwa Bldg. 7F, 12-22 Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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