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Patent Searching and Data


Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/207278
Kind Code:
A1
Abstract:
This heat pump device is provided with: a heat collection circuit in which an underground heat refrigerant is circulated inside heat collection piping; a heat pump circuit in which a heat pump refrigerant is circulated inside heat pump piping; and a heat exchanger that performs heat exchange between the underground heat refrigerant and the heat pump refrigerant, wherein the heat collection circuit has an underground heat exchanger which is formed by burying a portion of the heat collection piping under the ground and collects underground heat. The heat pump circuit has: a compressor which is connected to the heat pump piping and compresses the heat pump refrigerant; a control box in which electronic components for controlling the compressor are mounted, and which has a rear surface to which the heat collection piping is joined; and a fan which blows a flow of air onto the rear surface of the control box.

Inventors:
TOGAWA, Kazuki (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2017/017653
Publication Date:
November 15, 2018
Filing Date:
May 10, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F25B1/00; F25B30/06
Foreign References:
JP2005030708A2005-02-03
JP2010014340A2010-01-21
JP2010144976A2010-07-01
JP2012241984A2012-12-10
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (East 8F, TORANOMON TWIN BLDG. 10-1 Toranomon 2-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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