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Patent Searching and Data


Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/102595
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a heat pump device with which, by means of a configuration having little heat energy loss, heat can be applied to a refrigerant sucked into a compressor. This heat pump device (1) comprises: a compressor (2) that compresses a refrigerant; a first heat exchanger (8) that exchanges heat between a heat medium and the refrigerant compressed by the compressor (2); a heat-insulating material (12) at least partially covering the first heat exchanger (8); a decompression device (10) that decompresses the refrigerant on the downstream side of the first heat exchange (8); a second heat exchanger (7) that vaporizes the refrigerant on the downstream side of the decompression device (10); and an intake refrigerant passage (51, 11, 52), which is a passage connecting an outlet of the second heat exchanger (7) and an intake opening of the compressor (2). The heat-insulating material (12) has an inner surface facing the first heat exchanger (8) and an outer surface on the opposite side from the inner surface. The intake refrigerant passage (51, 11, 52) includes a heat absorption passage (11), which is a passage running between the inner surface and the outer surface of the heat-insulating material (12).

Inventors:
MOTEGI, Shuji (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2017/042262
Publication Date:
May 31, 2019
Filing Date:
November 24, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F24F1/16; F24F1/18; F24H4/02; F24H9/14; F25B30/02
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (Takada, Takahashi & Partners Konwa Bldg. 7F, 12-22 Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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