HEAT PUMP DEVICE

WIPO Patent Application WO/2020/204208

A1

A heat pump device (10) comprises: a housing (11) having a first side wall (14) and a second side wall (15) facing each other, and an upper wall (12); and a heat exchanger (25) and fans (37, 65) accommodated in the housing (11), wherein the first side wall (14) is provided with a first air intake (19) and the second side wall (15) is provided with second air intake (20) respectively; the upper wall (12) is provided with the first air outlet (22); the heat exchanger (25) includes a first heat exchange unit (33) arranged along the first side wall (14) and a second heat exchange unit (34) arranged along the second side wall (15); and the fans (37, 65) are arranged to be sandwiched between the first heat exchange unit (33) and the second heat exchange unit (34), have a rotation axis (40) in the direction intersecting the first side wall (14) and the second side wall (15), intake the air from the first air intake (19) and the second air intake (20) and discharge the air through the first air outlet (22).

TAMURA KEISHIROU (JP)
YAMAMOTO TAKAYOSHI (JP)
ONO TAKASHI (JP)
KASHIHARA TAKASHI (JP)
AKAGI HARUNA (JP)
SATOU KEN (JP)

PCT/JP2020/015512

October 08, 2020

April 06, 2020

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DAIKIN IND LTD (JP)

F28D1/047; F24F1/16; F24F1/18; F24F1/38; F24F1/46; F24F1/48; F24F1/50; F24F13/20; F24F13/30; F28F1/02; F28F21/08

JPS553546A	1980-01-11
JPH11218345A	1999-08-10
JPS55140068A	1980-11-01
JPS57190372U	1982-12-02
JPS4617390Y1	1971-06-17

SUNCREST PATENT AND TRADEMARK ATTORNEYS (JP)

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