HEAT PUMP HOT-WATER SUPPLY DEVICE

WIPO Patent Application WO/2011/151933

A1

Provided is a heat pump hot-water supply device capable of determining whether scale is deposited. Specifically disclosed is a heat pump hot-water supply device provided with a heat pump refrigerant circuit which is configured by connecting at least a compressor (1), a refrigerant-side heat transmission tube (2a) of a liquid refrigerant heat exchanger (2), a pressure reduction unit (4), and an air heat exchanger (5) by refrigerant piping, a liquid-to-be-heated circuit which is configured by connecting at least a pump (15) and a liquid-side heat transmission tube (2b) of the liquid refrigerant heat exchanger (2) by liquid piping, a first temperature sensor (20) which detects the temperature of a liquid to be heated on the outlet side of the liquid refrigerant heat exchanger (2), and an operation control means (52) which controls the heat pump refrigerant circuit and/or the liquid-to-be-heated circuit to perform a liquid heating operation, said heat pump hot-water supply device being provided with a second temperature sensor (24) which detects the temperature of the liquid to be heated on the upstream side from the liquid to be heated the temperature of which is detected by the first temperature sensor (20).

ENOKIZU YUTAKA (JP)
SUGIYAMA KAZUICHI (JP)
MURAYAMA MASAMI (JP)

PCT/JP2010/064099

December 08, 2011

August 20, 2010

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HITACHI APPLIANCES INC (JP)
ENOKIZU YUTAKA (JP)
SUGIYAMA KAZUICHI (JP)
MURAYAMA MASAMI (JP)

F24H1/00

JP2009243797A	2009-10-22
JP2004232912A	2004-08-19
JP2004053190A	2004-02-19
JP3783632B2	2006-06-07
JP2003194407A	2003-07-09
JP2004144445A	2004-05-20
JP2009150609A	2009-07-09

ISONO Michizo (JP)
Michizo Isono (JP)

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