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Title:
HEAT PUMP HOT WATER SUPPLY DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/118580
Kind Code:
A1
Abstract:
Provided is a heat pump hot water supply device that suppresses the amount of frost formation in an air heat exchanger and is capable of efficient operation. The heat pump hot water supply device comprises: a refrigerant circuit in which a refrigerant compressed by a compressor and decompressed by an expansion valve circulates through a closed circuit comprising the air heat exchanger and a water heat exchanger, said refrigerant circuit using four valves and repeatedly changing between gaseous and liquid states by switching the circulation direction of the refrigerant; and a water circuit wherein water that has been sent by a pump absorbs heat from the refrigerant and becomes hot in the water heat exchanger, and is supplied to a load. The present invention uses an air heat exchanger comprising a plurality of heat exchangers each having different amounts of air flowing therethrough and having a separate expansion valve connected to each of the heat exchangers. A control unit opens and closes the expansion valve and controls the supply and stopping of supply of refrigerant to the heat exchangers, thereby regulating the location and amount of frost formation.

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Inventors:
KADOWAKI KIMITAKA (JP)
YAMANO YOSHIO (JP)
Application Number:
PCT/JP2014/000701
Publication Date:
August 13, 2015
Filing Date:
February 10, 2014
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F24F11/02; F24H1/00; F25B47/02
Foreign References:
JP2010181104A2010-08-19
JP2011122735A2011-06-23
JP2013137192A2013-07-11
JP2008170015A2008-07-24
JP2013096661A2013-05-20
JP2013024485A2013-02-04
Other References:
See also references of EP 3106773A4
Attorney, Agent or Firm:
TAKAHASHI, Shogo et al. (JP)
Shogo Takahashi (JP)
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