HEAT PUMP HOT-WATER SUPPLY DEVICE

WIPO Patent Application WO/2017/085812

A1

The heat pump hot-water supply device according to the present invention is equipped with: a refrigerant circuit which is configured by a compressor, a hot-water supply heat exchanger, a heat-collecting throttle device, a heat storage heat exchanger, a main throttle device and an air heat exchanger being circularly connected by refrigerant pipes, and is configured by connecting an intake bypass pipe that causes the refrigerant flowing out from the heat storage heat exchanger to bypass the air heat exchanger and flow to the intake side of the compressor; a heat-storage-side secondary circuit which has the heat storage heat exchanger, a heat storage tank that stores heat storage material, and a heat storage pump that circulates the heat storage material between the heat storage heat exchanger and the heat storage tank; and a control device which implements operation control in such a manner that, by heat exchanging with the refrigerant in the hot-water supply heat exchanger, the water associated with hot-water supply is heated, and the storage of heat in the heat storage material or the collection of heat from the heat storage material is performed.

SAIKUSA TETSUJI (JP)
OBAYASHI TOMOYOSHI (JP)
TSUJI YUSUKE (JP)

PCT/JP2015/082409

May 26, 2017

November 18, 2015

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MITSUBISHI ELECTRIC CORP (JP)

F24H1/00; F24H9/00; F25B1/00; F25B30/02; F28D7/02; F28D7/10; F28D20/02

WO2013046720A1

2013-04-04

JP2008196769A	2008-08-28
JPH11118246A	1999-04-30
JP2008196791A	2008-08-28
JP2008261559A	2008-10-30
JPH1019482A	1998-01-23
JP2007178091A	2007-07-12
JP2006090697A	2006-04-06
JP2001207163A	2001-07-31
JP2005241148A	2005-09-08
JP2009243866A	2009-10-22

KISA PATENT & TRADEMARK FIRM (JP)

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