Title:
HEAT PUMP, AND HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2002/077546
Kind Code:
A1
Abstract:
Water is stored as a refrigerant in an evaporator (25) for a heat pump (20). Evaporation from the water surface in the evaporator (25) is accelerated by the driving of a compressor (22). Further, air-mingled water in an injection passageway (21a) is expanded and reduced in pressure in a valve (24) and then injected via an injection passageway (21b) into the water in the evaporator (25). The air contained in the injected water becomes bubbles which rise in the water contained in the evaporator (25). During this rising process, the water molecules around the bubbles evaporate. That is, evaporation can take place not only from the water surface in the evaporator (25) but also in the water. This makes it possible to increase the evaporation rate and to improve the output of the heat pump (20).
Inventors:
ISHII TETSUYA (JP)
YASHIRO SUSUMU (JP)
YASHIRO SUSUMU (JP)
Application Number:
PCT/JP2002/002374
Publication Date:
October 03, 2002
Filing Date:
March 13, 2002
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
ISHII TETSUYA (JP)
YASHIRO SUSUMU (JP)
ISHII TETSUYA (JP)
YASHIRO SUSUMU (JP)
International Classes:
F25B9/00; (IPC1-7): F25B19/00; F25D7/00
Foreign References:
| JP5761148B2 | 2015-08-12 | |||
| JP7065822B2 | 2022-05-12 | |||
| JPH0359361A | 1991-03-14 | |||
| JPH0599447A | 1993-04-20 | |||
| JPS5438025Y2 | 1979-11-13 |
Attorney, Agent or Firm:
Watanabe, Noboru (7-7 Kudanminami 3-chome Chiyoda-ku, Tokyo, JP)
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