HEAT PUMP SYSTEM

WIPO Patent Application WO/2010/103825

A1

A heat pump system having increased cycle efficiency in processing of a heat load by a secondary refrigerant. A heat pump circuit (10) in which a carbon dioxide refrigerant circulates has a low-stage compressor (21), a high-stage compressor (25), an expansion valve (5), and an evaporator (4). A heating circuit (60) in which water as a secondary refrigerant circulates has a radiator (61). The heating circuit in which the water as the heat medium for heating circulates has a intermediate-pressure branch path (67) and a high-pressure branch path (68) which are arranged parallel to each other. A control section (11) operates a mixing valve (64) for heating so that the temperature of the secondary refrigerant in a portion of the intermediate-pressure branch path (67), said portion being heated by an intermediate-pressure water heat exchanger (40), and the temperature of the secondary refrigerant in a portion of the high-pressure branch path (68), said portion being heated by a second high-pressure water heat exchanger (52), are the same.

YAMADA TAKURO (JP)
OKUDA NORIYUKI (JP)
FUJIMOTO SHUJI (JP)
YOSHIMI ATSUSHI (JP)

PCT/JP2010/001698

September 16, 2010

March 10, 2010

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DAIKIN IND LTD (JP)
YAMADA TAKURO (JP)
OKUDA NORIYUKI (JP)
FUJIMOTO SHUJI (JP)
YOSHIMI ATSUSHI (JP)

F25B1/00; F25B1/10; F25B6/04

WO2009001535A1

2008-12-31

JP2002106988A	2002-04-10
JP2006258397A	2006-09-28
JP2003269788A	2003-09-25
JP2003240369A	2003-08-27
JP2008209012A	2008-09-11
JP2007322077A	2007-12-13
JP2006275494A	2006-10-12
JPH024A	1990-01-05
JPS6477067A	1989-03-23
JP2004177067A	2004-06-24

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