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Patent Searching and Data


Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/068649
Kind Code:
A1
Abstract:
In the present invention, a main circuit (110) includes a compressor (10), an outdoor heat exchanger (20), a main expansion valve (30), and an indoor heat exchanger (40), and is configured so as to allow a refrigerant to circulate therethrough. A bypass flow path (120) is configured so as to cause the refrigerant flowing through the main circuit (110) to bypass the outdoor heat exchanger (20). A three-way valve (60) is configured so as to be capable of adjusting the ratio of the flow rate of the refrigerant flowing through the outdoor heat exchanger (20) to the flow rate of the refrigerant discharged from the compressor (10). A branch flow path (130) is connected between the outdoor heat exchanger (20) and the main expansion valve (30) and is configured so as to be capable of partially branching the refrigerant flowing through the main circuit (110). A sub-expansion valve (70) is configured so as to be capable of adjusting the flow rate of the refrigerant flowing through the branch flow path (130). An internal heat exchanger (80) performs heat exchange between the refrigerant flowing through the branch flow path (130) and the refrigerant flowing from the outdoor heat exchanger (20) to the main expansion valve (30).

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Inventors:
TANAKA CHITOSE (JP)
MATSUDA TAKUYA (JP)
TANAKA KOSUKE (JP)
Application Number:
PCT/JP2015/079571
Publication Date:
April 27, 2017
Filing Date:
October 20, 2015
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00; F24F11/02
Foreign References:
JP2004271166A2004-09-30
JPH06265232A1994-09-20
JP2005300157A2005-10-27
JP2009198099A2009-09-03
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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