Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/195275
Kind Code:
A1
Abstract:
This heat pump system is provided with: a first piping for sequentially connecting a low temperature heating-side refrigerant circuit; a high temperature heating-side refrigerant circuit, a low temperature-side liquid supply port, a low temperature heating-side condenser, and a high temperature heating-side evaporator, and channeling a liquid; a second piping for sequentially connecting a high temperature-side liquid supply port and a high temperature heating-side condenser and channeling a liquid; a pump provided to the first piping, the pump pumping the liquid heated by the low temperature heating-side condenser to the high temperature heating-side evaporator; a control valve provided to the first piping between the low temperature heating-side condenser and the high temperature heating-side evaporator, the control valve controlling the flow rate of the liquid channeled through the first piping; and a control unit for controlling the pump and/or the control valve and controlling the flow rate of the liquid pumped from the low temperature heating-side condenser to the high temperature heating-side evaporator.
Inventors:
KADOWAKI KIMITAKA (JP)
Application Number:
PCT/JP2016/063892
Publication Date:
November 16, 2017
Filing Date:
May 10, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B7/00; F25B1/00; F25B30/02
Domestic Patent References:
| WO2010013590A1 | 2010-02-04 |
Foreign References:
| JP2011257036A | 2011-12-22 | |||
| JPH0336467A | 1991-02-18 | |||
| JPH01314864A | 1989-12-20 | |||
| JP2012042177A | 2012-03-01 |
Other References:
See also references of EP 3457050A4
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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