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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2018/042482
Kind Code:
This heat pump system is provided with: a compressor that compresses a refrigerant; a gas cooler that exchanges heat between the refrigerant compressed by the compressor, and a heating medium in a liquid state; a decompressing device that decompresses the refrigerant; the refrigerant decompressed by the decompressing device; and an evaporator that exchanges heat with outside air. The gas cooler has: a heating medium pipe having a spiral groove that is formed in the outer peripheral surface; and a refrigerant pipe that is spirally wound along the spiral groove. The compressor is disposed in a space covered with the gas cooler.

TONEGAWA, Toru (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
Publication Date:
March 08, 2018
Filing Date:
August 29, 2016
Export Citation:
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MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
F25B1/00; F25B39/04
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (Takada, Takahashi & Partners Konwa Bldg. 7F, 12-22 Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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