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Patent Searching and Data


Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/143726
Kind Code:
A1
Abstract:
The present invention relates to a heat pump system comprising: an outdoor unit installed in an outdoor space; a plurality of heat load units supplied with cold air and warm air; and an intermediate unit arranged between the outdoor unit and the plurality of heat load units, wherein the intermediate unit is connected to the outdoor unit through a refrigerant tube and is connected to the plurality of heat load units through a heat medium tube.

Inventors:
SAITO MASAKI (JP)
TAKAHARA TAKESHI (JP)
KODA KIMIO (JP)
TAJIMA KAZUSHIGE (JP)
Application Number:
PCT/KR2018/001455
Publication Date:
August 09, 2018
Filing Date:
February 02, 2018
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
F25B41/00; F25B49/02
Foreign References:
JP5241923B22013-07-17
JP2006194537A2006-07-27
KR20120083139A2012-07-25
KR101605981B12016-03-23
KR101548416B12015-08-28
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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