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Patent Searching and Data


Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/171485
Kind Code:
A1
Abstract:
A heat pump system according to the present invention has: a refrigerant circuit in which there are connected a compressor, a refrigerant channel of a heat-medium heat exchanger that has a refrigerant channel and a heat medium channel, an expansion valve, and a heat-source-side heat exchanger; a heat medium conveyance path connected to the heat medium channel of the heat-medium heat exchanger; an indoor unit that is connected to the heat medium conveyance path and that air-conditions the interior of a room; a room temperature sensor that detects the indoor temperature in said interior; a heat medium temperature sensor that detects the temperature of a heat medium flowing into the indoor unit; and a control device that uses a setting temperature of the interior, the indoor temperature detected by the room temperature sensor, and the temperature detected by the heat medium temperature sensor to control the refrigerant circuit or the indoor unit so that the indoor temperature detected by the room temperature sensor does not deviate far from the setting temperature.

Inventors:
HAYASHIDA KAZUKI (JP)
OKOSHI YASUSHI (JP)
ITO TAKUYA (JP)
YAMANO YOSHIO (JP)
KADOWAKI KIMITAKA (JP)
AKIZUKI TAKAHIRO (JP)
Application Number:
PCT/JP2018/008716
Publication Date:
September 12, 2019
Filing Date:
March 07, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F24F11/83; F24F5/00; F24F11/41; F24F11/42; F25B1/00
Domestic Patent References:
WO2013077167A12013-05-30
Foreign References:
JP2011058659A2011-03-24
JP2009109060A2009-05-21
JP2011064438A2011-03-31
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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