Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/188668
Kind Code:
A1
Abstract:
The present disclosure provides a heat pump system, comprising: a first-stage circuit, a first-stage compressor, a condenser/evaporator, a first-stage main path expansion valve, and a first-stage evaporator being sequentially arranged on the first-stage circuit along the flow direction of a refrigerant; a second-stage circuit, a second-stage compressor, a second-stage condenser, an enhanced vapor injection heat exchanger, a second-stage main path expansion valve, and a condenser/evaporator being sequentially arranged on the second-stage circuit along the flow direction of the refrigerant; the condenser/evaporator being used as a condenser in the first-stage circuit and being used as an evaporator in the second-stage circuit; and an enhanced vapor injection branch, the first-stage compressor having a first refrigerant supplementing port; the enhanced vapor injection branch extending from a first branch point on the first-stage circuit located at the downstream of the condenser/evaporator, passing through the enhanced vapor injection heat exchanger, and being connected to the first refrigerant supplementing port.
Inventors:
YANG CHUN (CN)
Application Number:
PCT/CN2022/078712
Publication Date:
September 15, 2022
Filing Date:
March 02, 2022
Export Citation:
Assignee:
EMERSON CLIMATE TECH SUZHOU CO LTD (CN)
International Classes:
F25B7/00
Foreign References:
| CN214746577U | 2021-11-16 | |||
| US20030024262A1 | 2003-02-06 | |||
| CN105758050A | 2016-07-13 | |||
| CN108692475A | 2018-10-23 | |||
| KR101260900B1 | 2013-05-06 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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