Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/281701
Kind Code:
A1
Abstract:
This heat pump system uses a heat medium flowing through a heat medium circuit to regulate the temperature of a target. A heat source apparatus of the present invention regulates the temperature of the heat medium by exchanging heat with a coolant. The heat pump system has a flow rate acquiring device for acquiring the flow rate of the heat medium. The heat source apparatus comprises a compressor, a heat medium heat exchanger, and a control device. The heat medium heat exchanger causes heat to be exchanged between the heat medium and the coolant. The control device has an adjustment calculating unit and a control calculating unit. When a first condition is satisfied, the adjustment calculating unit uses the operating frequency of the compressor to calculate an adjustment amount for adjusting a first flow rate of the heat medium on the basis of the measurement result acquired by the flow rate acquiring device. The control calculating unit uses the adjustment amount to adjust the first flow rate of the heat medium on the basis of the measurement result acquired by the flow rate acquiring device.
Inventors:
KADOWAKI KIMITAKA (JP)
ITO MASAHIRO (JP)
GYOTOKU SHUNYA (JP)
ITO TAKUYA (JP)
ITO MASAHIRO (JP)
GYOTOKU SHUNYA (JP)
ITO TAKUYA (JP)
Application Number:
PCT/JP2021/025796
Publication Date:
January 12, 2023
Filing Date:
July 08, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00
Domestic Patent References:
| WO2016194190A1 | 2016-12-08 |
Foreign References:
| JP2011141097A | 2011-07-21 | |||
| JP2012097923A | 2012-05-24 | |||
| JP2018096554A | 2018-06-21 | |||
| JP2011064649A | 2011-03-31 | |||
| JP2014035092A | 2014-02-24 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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