HEAT-PUMP UTILIZATION DEVICE

WIPO Patent Application WO/2018/235125

A1

A heat-pump utilization device according to the present invention is provided with a refrigerant circuit and a heat medium circuit. The refrigerant circuit is capable of performing a heating operation and a cooling operation. A first expansion device and a second expansion device are respectively disposed at the downstream side and the upstream side of a vessel, in the flow of a refrigerant during the heating operation. A main circuit of the heat medium circuit has a branch part and a merge part. A pressure protection device is connected to a connection part located between a load-side heat exchanger and one of the branch part and the merge part or located at the load-side heat exchanger. A refrigerant leakage detecting device is connected to the other of the branch part and the merge part, is connected between the connection part and the other of the branch part and the merge part, or is connected to the connection part. When leakage of the refrigerant into the heat medium circuit is detected, a refrigerant flow-path switching device is put in a cooling operation state, the first expansion device is put in an open state, the second expansion device is put in a closed state, and a compressor is operated.

SUZUKI YASUHIRO (JP)
MINAMISAKO HIROKAZU (JP)
SUZUKI KAZUTAKA (JP)
MITO TAKAFUMI (JP)
HATTORI TARO (JP)

PCT/JP2017/022499

December 27, 2018

June 19, 2017

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MITSUBISHI ELECTRIC CORP (JP)

F25B1/00; F25B43/00; F25B49/02

WO2013038577A1

2013-03-21

JP2013167398A	2013-08-29
JP2015209979A	2015-11-24
JP2009257756A	2009-11-05
JP2015094574A	2015-05-18
JP2002228281A	2002-08-14
JP2013167398A	2013-08-29

See also references of EP 3467399A4

KISA PATENT & TRADEMARK FIRM (JP)

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