HEAT PUMP

WIPO Patent Application WO/2011/062349

A4

The present invention relates to a heat pump comprising a refrigerating cycle unit and a booster module. The refrigerating cycle unit comprises: a compressor in which a refrigerant is compressed; a first heat exchanger in which the refrigerant compressed by the compressor is condensed; an expansion device in which the refrigerant condensed by the first heat exchanger expands; and a second heat exchanger in which the refrigerant expanded by the expansion device evaporates. The booster module is connected to the refrigerating cycle to separate a refrigerant vapor from the refrigerant flowing from the first heat exchanger to the expansion device, compress the separated refrigerant vapor, and enable the compressed refrigerant to flow between the compressor and the first heat exchanger, or to compress the refrigerant evaporated in the second heat exchanger and enable the compressed refrigerant to flow between the compressor and the first heat exchanger. The heat pump of the present invention is advantageous in that heating ability can be conveniently improved, and optimum performance can be achieved in accordance with a variety of load conditions which might not be handled by a compressor of a refrigerating cycle unit alone.

JP5615381	Hot water supply and air conditioning complex
JP4059616	Heat pump type water heater
JP4756035	Water heater

CHIN SIM WON (KR)
JANG YONG HEE (KR)
KIM BUM SUK (KR)
RYU BYOUNG JIN (KR)

PCT/KR2010/004791

July 28, 2011

July 21, 2010

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LG ELECTRONICS INC (KR)
CHIN SIM WON (KR)
JANG YONG HEE (KR)
KIM BUM SUK (KR)
RYU BYOUNG JIN (KR)

F25B30/02; F25B41/06; F25B43/02; F25B49/02

PARK, BYUNG CHANG (KR)
박병창 (KR)

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