Title:
HEAT RADIATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/239920
Kind Code:
A1
Abstract:
This heat radiating device 10 is provided with a heat radiating part 11 for radiating the heat of a heat generating body, and a fan 13 provided on a surface opposite to a surface on which the heat generating body of the heat radiating part 11 is located. The heat radiating part 11 is formed by stacking a plurality of plate-like heat radiating plates 11a-11f, and comb-like fin parts that extend radially in the in-plane direction are formed on the peripheries of the respective heat radiating plates 11a-11f.
More Like This:
JP2015159149 | COOLING DEVICE AND SEMICONDUCTOR DEVICE |
JP2019047029 | HEAT DISSIPATION STRUCTURE OF CIRCUIT BOARD |
JPH01150344 | MANUFACTURE OF ELECTRONIC CIRCUIT PACKAGE ASSEMBLY |
Inventors:
MITSUNARI TAKASHI
NAKANO KENICHI
SAKAMOTO KATSUYA
MINESAKI YOUHEI
HIGASHIMOTO YOSHITADA
NAKANO KENICHI
SAKAMOTO KATSUYA
MINESAKI YOUHEI
HIGASHIMOTO YOSHITADA
Application Number:
PCT/JP2019/021709
Publication Date:
December 19, 2019
Filing Date:
May 31, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K7/20; G06F1/20; H01L23/36; H01L23/467
Foreign References:
JP2003318582A | 2003-11-07 | |||
JP2005197303A | 2005-07-21 | |||
US20120188716A1 | 2012-07-26 | |||
US6575231B1 | 2003-06-10 | |||
JP2012164512A | 2012-08-30 | |||
JP2009170607A | 2009-07-30 | |||
US20120193085A1 | 2012-08-02 | |||
JP2014099578A | 2014-05-29 | |||
JP2000332474A | 2000-11-30 |
Attorney, Agent or Firm:
WASHIDA, Kimihito (JP)
Download PDF: