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Patent Searching and Data


Title:
HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/158222
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure comprises: a housing; a display arranged in the housing; a support member which supports the display, and which comprises a first surface facing the display, a second surface facing the opposite direction of the first surface, and a first opening penetrating at least one portion of the first surface and the second surface; a battery which is arranged on the second surface of the support member, and which has at least one portion facing the first opening; a printed circuit board arranged on the second surface of the support member and spaced from the battery; and a heat-radiating member configured to mediate heat transfer between the display and the printed circuit board, wherein the heat-radiating member comprises a first area having least one portion overlappingly arranged on the first surface, and a second area which is coupled to the first area and which has at least one portion arranged in the first opening, and the at least one portion of the first area can be coupled to the support member by means of laser welding. Other various embodiments are possible.

Inventors:
AHN JOSEPH (KR)
LEE YOUNGCHUL (KR)
KIM TAEHYEONG (KR)
MOON HONGKI (KR)
PARK JONGKIL (KR)
Application Number:
PCT/KR2023/002225
Publication Date:
August 24, 2023
Filing Date:
February 15, 2023
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/20; B23K26/073; G06F1/16; H04M1/02; H05K7/20
Foreign References:
US20150083371A12015-03-26
US20200205316A12020-06-25
KR20200093261A2020-08-05
KR20180014603A2018-02-09
KR20160009914A2016-01-27
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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