Title:
HEAT RADIATION ADHESIVE, HEAT RADIATION SHEET USING SAME, AND ELECTRONIC DEVICE HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2015/199467
Kind Code:
A1
Abstract:
The present invention relates to a heat radiation adhesive, a heat radiation sheet using the same, and an electronic device having the same. The heat radiation adhesive comprises: an adhesive layer; a first heat conductive filler which is dispersed inside the adhesive layer and horizontally diffuses heat generated by a heat generation component of an electronic device; and a second heat conductive filler which is dispersed inside the adhesive layer and transfers, to the first heat conductive filler, the heat generated by the heat generation component of the electronic device.
Inventors:
HWANG SEUNG JAE (KR)
Application Number:
PCT/KR2015/006505
Publication Date:
December 30, 2015
Filing Date:
June 25, 2015
Export Citation:
Assignee:
AMOGREENTECH CO LTD (KR)
International Classes:
C09J11/04; C09J7/20; C09J9/00
Foreign References:
| KR20120125365A | 2012-11-14 | |||
| JP2006137833A | 2006-06-01 | |||
| KR101238013B1 | 2013-02-26 | |||
| KR20060027210A | 2006-03-27 | |||
| KR20120073792A | 2012-07-05 | |||
| KR20140019737A | 2014-02-17 |
Attorney, Agent or Firm:
LEE, JAE HWA (KR)
이재화 (KR)
이재화 (KR)
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