HEAT RADIATION CONSTRUCTION FOR ELECTRONIC DEVICES - SONY COMPUTER ENTERTAINMENT INC

Title:

HEAT RADIATION CONSTRUCTION FOR ELECTRONIC DEVICES

Document Type and Number:

WIPO Patent Application WO/2004/034763

Kind Code:

A1

Abstract:

A heat radiation construction for electronic devices has a heating element and a heat radiation member. The heat radiation member has an inner wall, an outer wall and a plurality of partition walls. The inner wall receives heat transmitted from the heating element. The outer wall is spaced from and opposed to the inner wall. The partition walls connect the inner and outer walls and cooperate with the inner and outer walls to define a plurality of through hole of substantially the same shape disposed at substantially equal intervals along the inner or outer wall. The through holes are arranged along a vertical direction in which the influence of gravity can be utilized most effectively, and their upper and lower ends open to the outside.

Inventors:

YAZAWA KAZUAKI

Application Number:

PCT/JP2003/012879

Publication Date:

April 22, 2004

Filing Date:

October 08, 2003

Export Citation:

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Assignee:

SONY COMPUTER ENTERTAINMENT INC (JP)

International Classes:

F28F3/12; H05K7/20; (IPC1-7): H05K7/20

Foreign References:

JPH11233977A	1999-08-27
JP2002111263A	2002-04-12
JP2000352399A	2000-12-19
JPH09212258A	1997-08-15
US5276584A	1994-01-04
EP1182915A1	2002-02-27

Other References: