DAI, Chenglong (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
YANG, Canbang (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
YUAN, Haiping (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
CHEN, Xiaomian (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
DAI, Chenglong (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
YANG, Canbang (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
YUAN, Haiping (5F Hantang Building, OCT Oversea Chinese TownShenzhen, Guangdong 3, 51805, CN)
| A heat radiation device for an electronic device, com¬ prising a heat conducting base (1) and at least one heat sink fin (2) mounted on the heat conducting base (1), characterized in that the heat sink fin (2) is de¬ signed to have a wave contour. The heat radiation device according to claim 1, characterized in that the heat conducting base (1) is formed integrally with the heat sink fin (2) . The heat radiation device according to claim 1, characterized in that the heat conducting base (1) and the heat sink fin (2) are separately formed, wherein, the heat sink fin (2) is inserted into the heat conducting base ( 1 ) . The heat radiation device according to claim 3, characterized in that the heat conducting base (1) is pro¬ vided with a heat conducting support (3) perpendicular to the heat conducting base (1) and extending outward, and the respective heat sink fins (2) are stacked on the heat conducting support (3) parallel to each other with a predetermined gap therebetween. The heat radiation device according to any of claims 1 to 3, characterized in that the heat sink fins (2) are perpendicularly erected on the heat conducting base (1) parallel to each other with a predetermined gap there¬ between . The heat radiation device according to any of claims 1 to 3, characterized in that the heat sink fins (2) are perpendicularly erected on the heat conducting base (1) in a circle. 7. The heat radiation device according to any of claims 1 to 3, characterized in that the heat sink fin has a wa¬ ve contour in a sinusoid shape or a square wave shape. 8. The heat radiation device according to any of claims 1 to 3, characterized in that the ratio of the wave crest of the wave contour of the heat sink fin to the thick¬ ness of the heat sink fin is 2:1. 9. The heat radiation device according to any of claims 1 to 4, characterized in that the heat conducting base (1) and/or the heat sink fin (2) are made through a liquid forging process. 10. An electronic device, characterized in that the elec¬ tronic device comprises the heat radiation device ac¬ cording to any of claims 1 to 9. |
Heat Radiation Device and Electronic Device Comprising The Heat Radiation Device
5 Field of the Invention
The present invention relates to a heat radiation device for electronic devices. In addition, the present invention also relates to an electronic device comprising the heat radiation device.
Background Art
10 In the prior art usually a heat radiation device is used for the heat radiation of an electronic device. This type of heat radiation device usually has a base in contact with a heating portion of the electronic device, and multiple flat heat sink fins are provided at the base. Experiments show that, under the same external conditions such as a convection condition, the heat radiation effect of the heat radiation del s vice completely depends on the contact area of the heat sink fins on the heat radiation device with air, that is, the area of the heat radiation surface for heat exchange with air. The larger the area is, the better the heat radiation effect of the heat radiation device is. To obtain fine heat radiation effect, one must conceive increasing the size of the heat radiation device or mounting a fan for strengthening 20 convection on the heat radiation device. However, with the gradual miniaturization of the volume of current electronic devices, it is also required that the volume of the heat radiation device mounted on the electronic device should be as small as possible, so as to reduce the overall size of the whole apparatus. This brings a problem of how to obtain as fine heat radiation effect as possible without increas-
25 ing the total size of the heat radiating device.
Summary of the Invention
Therefore, the present invention aims to provide a heat radiation device for an electronic device. The heat radiation device according to the present invention can obtain an increased heat radiation area without increasing its total size sub-
30 stantially. The object of the present invention is achieved by a heat radiation device, and the heat radiation device comprises a heat conducting base and at least one heat sink fin mounted on the heat conducting base, wherein the heat sink fin is designed to have a wave contour. Compared with a traditional panel-shape heat radiation de- vice having the same size, the heat radiation device according to the present invention has an obviously increased heat radiation area. In practice, the heat radiation amount of the heat radiation device is calculated via the following equation: Ω=ζΑ(ϋΤ1 -ϋΤ2), wherein Q represents the heat radiation amount; A represents the total area of the heat sink fins of the heat radiation device; DT1 represents a temperature at a certain point at the heat sink fin when the heat radiation device works; DT2 represents the ambient temperature around the heat sink fins; and ζ represents a convection coefficient which is related to factors such as the convection state around the heat sink fins and the physical size of the heat sink fins per se, wherein, when the ζ is constant (wherein, to keep ζ constant, it is necessary to keep the gap between the heat sink fins unchanged and the height of the heat sink fins unchanged, and geometric shapes should be similar), the larger the total area of the heat sink fins is, the more the heat from the heat radiation device is. As the heat radiation device of the present invention uses a wave heat sink fin, the heat sink fin designed according to the present invention has a larger heat radiation area in case the area of its projection on the horizontal plane is the same with the area of projection of a traditional heat sink fin, and thus the heat radiation device according to the present invention has better heat radiation effect. In addition, the fins according to present invention are mechanically stiffer and therefore the thickness can be reduced if e certain stability is needed or otherwise if the thickness is kept at the same level the stability is improved.
According to a preferable design of the present invention, the heat conducting base is formed integrally with the heat sink fins. This simplifies the process of making the heat radiation device and lowers the production cost.
According to another design of the present invention, the heat conducting base and the heat sink fin are separately formed, wherein, the heat sink fin is inserted into the heat conducting base. To a large extent the heat conducting base and the heat sink fin can be combined flexibly by simply inserting the heat sink fin into a receiving portion provided in the heat conducting base in advance in a later phase, and thus heat radiation devices of different heat radiation efficiencies can be made in a simple way according to the heat radiation demands of different electronic devices. Alternatively, the heat conducting base is provided with a heat conducting support perpendicular to the heat conducting base and extending outward, and the respective heat sink fins are stacked on the heat conducting support parallel to each other with a predetermined gap therebetween. In this design, the respective heat sink fins are respectively provided parallel to the heat conducting base and keep a certain distance therebetween, thereby obtaining a fine convection condition.
As put forward in a preferable design of the present invention, the heat sink fins are perpendicularly erected on the heat conducting base parallel to each other with a predetermined gap therebetween, so as to form on the heat conducting base heat sink fin arrays arranged in parallel. This structure has a fine convection condition, thereby obtaining a heat radiation device having fine heat radiation effect.
As put forward in another preferable design of the present invention, the heat sink fins are perpendicularly erected on the heat conducting base in a circle. These heat sink fins jointly form a round contour on the heat conducting base. Of course, the heat sink fins can also form other contours on the heat conducting base, such as a circle, so that the heat radiation device can match different mounting spaces and electronic devices.
Preferably, the heat conducting base and/or the heat sink fin are made through a liquid forging process. The heat radiation device is usually made of a metal having a high heat conducting coefficient, and this metal can be more easily processed and treated via the liquid forging process, which, to a large extent, simplifies the production process and lowers the production cost.
Most preferably, the heat sink fin has a wave contour in a sinusoid shape or a square wave shape. Alternatively, the wave contour of the heat sink fin may be in a saw-shape or a triangular wave shape. The ratio of the wave crest of the wave contour to the thickness of the heat sink fin can be adjusted correspondingly according to needs on heat radiation, preferably, 2: 1 , and the wavelength in relation to the value of the length or height of the overall heat sink fin can be correspond- ingly adjusted according to needs on heat radiation. In addition, the value of the distance between the heat sink fins does not change with respect to the prior art, thereby ensuring the constancy of the convection coefficient. The other object of the present invention is achieved via an electronic device comprising the above type of heat radiation device. The electronic device comprising this heat radiation device can obtain better heat radiation effect without change of the overall size thereof. It should be understood that the above general description and the following detailed description are for listing and explanation, and aim to provide further explanation of the claimed invention.
Brief Description of the Accompanying Drawings
The accompanying drawings constitute a part of the description and are used to provide further understanding of the present invention. Such accompanying drawings illustrate the embodiments of the present invention and are used to describe the principles of the present invention together with the description. In the accompanying drawings the same components are represented using the same reference. As shown in the drawings: Figure 1 illustrates the first embodiment of a heat radiation device according to the prior art;
Figure 2 illustrates the second embodiment of the heat radiation device according to the prior art;
Figure 3 illustrates the third embodiment of the heat radiation device according to the prior art;
Figure 4 illustrates the first embodiment of a heat radiation device according to the present invention;
Figure 5 illustrates the second embodiment of the heat radiation device according to the prior art; and Figure 6 illustrates the third embodiment of the heat radiation device according to the prior art. Detailed Description of the Invention
Figures 1 -3 illustrate three different embodiments of a heat radiation device according to the prior art. In the first embodiment shown in Figure 1 , multiple heat sink fins 2 are arranged on a rectangular heat conducting base 1 and are perpen- dicularly erected on the heat conducting base 1 parallel to each other with a certain gap therebetween. The heat sink fins 2 can be formed integrally with the heat conducting base 1 , while they can be formed separately. Seen from Figure 1 , such heat sink fins 1 are flat heat sink plates.
In the second embodiment shown in Figure 2, multiple heat sink fins 2 are ar- ranged on a round heat conducting base 1 and perpendicularly erected on the heat conducting base 1 in a circle, thereby forming a shape similar to a lantern. Seen from Figure 2, such heat sink fins 1 are all flat heat sink plates which are respectively inserted into a receiving portion provided in the heat conducting base in advance. In the third embodiment shown in Figure 3, two heat conducting supports 3 are provided on the heat conducting base 1 perpendicular to the heat conducting base and extending outward, and respectively pass through respective heat sink fins 2, and also, such heat sink fins 2 are parallel to each other and spaced apart at a certain distance, thereby forming a heat radiation structure fixed on the heat con- ducting supports 3 and stacked on the heat conducting base 1 . In this embodiment, the heat sink fins 2 are also flat heat sink plates.
Figures 4-6 respectively illustrate three different embodiments of a heat radiation device according to the present invention corresponding to the heat radiation device of the prior art in Figures 1 -3. The difference between the three embodiments shown in Figures 4-6 and the prior art only lies in the shape of the heat sink fin. In the three embodiments of the present invention, the heat sink fin 2 has a wave contour, and thus compared with the heat radiation device of the prior art, obtains an increased heat radiation area without changing the overall size.
In the first embodiment of the present invention shown in Figure 4, the heat radia- tion device comprises a rectangular heat conducting base 1 and multiple heat sink fins 2, and such heat sink fins 2 have a wave contour and are perpendicularly erected on the heat conducting base 1 parallel to each other with a certain gap therebetween. In the second embodiment of the present invention shown in Figure 5, the heat radiation device comprises a round heat conducting base 1 and multiple heat sink fins 2, and such heat sink fins 2 have a wave contour and are perpendicularly erected on the heat conducting base 1 in a circle. In the third embodiment of the present invention shown in Figure 6, the heat radiation device comprises a heat conducting base 1 and multiple heat sink fins 2, wherein a heat conducting support 3 is provided on the heat conducting base 1 perpendicular to the heat conducting base and extending outward, and the respective heat sink fins 2 are stacked on the heat conducting support 3 parallel to each other with a predetermined gap therebetwee.
It should be understood that the heat conducting base 1 of the heat radiation device according to the present invention can be in other shapes besides the above shape and thus can adapt to different electronic devices and mounting environments. In addition, the heat conducting base 1 and the heat sink fins of the heat radiation device according to the present invention can be formed integrally or separately via a liquid forging process.
The heat radiation device according to the present invention is described according to one specific embodiment. For example, based on the heat radiation device according to the prior art, it comprises a flat heat sink fin 2 and has a heat radia- tion area of 169000 mm 2 . Compared with the prior art, as the heat radiation device according to the present invention uses a wave shape heat sink fin 2, and then has a heat radiation area of 210000 mm 2 without changing the overall size. Hence, in the case of the same room temperature such as 25D, the same natural convection and the same thermal source power such as 40W, it can be calculated from the equation 0=ζΑ(ϋΤ1 -DT2) that the heat radiation device according to the present invention has better heat radiation effect.
The descriptions above are only preferable embodiments of the present invention and are not used to restrict the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modifications, equivalent substitutions, improvements etc. within the spirit and principle of the present invention shall all be included in the scope of protection of the present invention. Reference signs:
1 heat conducting base
2 heat sink fin
3 heat conducting support
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