Title:
HEAT RADIATION STRUCTURE OF LED LIGHTING DEVICE HAVING EXPANDED THERMAL PAD
Document Type and Number:
WIPO Patent Application WO/2011/152608
Kind Code:
A1
Abstract:
The present invention relates to a heat radiation structure of an LED lighting device having an expanded thermal pad, wherein: a thermal pad part of an LED is widely expanded on a PCB to which a metal PCB or an LED is attached, so that a metal band, a heat radiation material such as copper or aluminum having an excellent radiation performance is attached to the expanded thermal pad; and the attached heat radiation material is connected to a heat sink of the lighting device in such a manner that the heat discharged from the thermal pad of the LED is directly and immediately delivered to the heat sink of the lighting device.
Inventors:
SHIN, Kwang Kyun (1 KookJae apartment, IlsanDong Wonjusi, Gangwondo 220-785, 220-785, KR)
Application Number:
KR2011/001508
Publication Date:
December 08, 2011
Filing Date:
March 04, 2011
Export Citation:
Assignee:
HANACNS. CO. LTD (1720-22 Taejang-Dong, Wonjusi, GangWondo 220-120, 220-120, KR)
주식회사 하나씨엔에스 (원주시 강원도 원주시 태장동 1720-22, 220-120 Gangwondo, 220-120, KR)
주식회사 하나씨엔에스 (원주시 강원도 원주시 태장동 1720-22, 220-120 Gangwondo, 220-120, KR)
International Classes:
F21V29/00; F21Y101/02
Attorney, Agent or Firm:
CHOI, Hak Hyun (301 3F, Woojoo Building 140-29,Gasan-Dong, Geumcheon-gu, Seoul 153-801, 153-801, KR)
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