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Patent Searching and Data


Title:
HEAT RAY SHIELDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/152147
Kind Code:
A1
Abstract:
Disclosed is a heat ray shielding material comprising a layer containing at least two layers of metal particles, which contain at least one type of metal particle, and a transparent dielectric layer having at least one layer, said hot wire shielding material having a structure in which the layer containing the metal particles and the dielectric layer are alternately laminated. The optical thickness (nd) of at least one of the dielectric layers satisfies formula (1) below with respect to the wavelength (λ1) at which reflectance is at a minimum value. {(2m + 1) × (λ1/4)} - {(λ1/4) × 0.25} < nd < (2m + 1) × (λ1/4)} + {(λ1/4) × 0.25} Formula (1) In formula (1): m represents an integer of 0 or higher; λ1 represents the wavelength at which reflectance is at a minimum value; n represents the refractive index of the dielectric layer; and d represents the thickness of the dielectric layer (nm).

Inventors:
HAKUTA SHINYA (JP)
TANI TAKEHARU (JP)
KIYOTO NAOHARU (JP)
Application Number:
PCT/JP2011/059764
Publication Date:
December 08, 2011
Filing Date:
April 20, 2011
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
HAKUTA SHINYA (JP)
TANI TAKEHARU (JP)
KIYOTO NAOHARU (JP)
International Classes:
C03C17/36; G02B5/26; G02B5/28
Foreign References:
JP2007108536A2007-04-26
JPH04357025A1992-12-10
JP2001310407A2001-11-06
JP2002055626A2002-02-20
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
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Claims: