Title:
HEAT RESISTANCE RESIN COMPOSITION AND INJECTION MOLDED BODY THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/054676
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a heat resistance resin composition that does not cause stringing when used in fusion-bonding using heated plates. The present invention provides a heat resistance resin composition which contains a maleimide copolymer (A) and at least one resin (B) selected from ABS resins, ASA resins, AES resins, and SAN resins, and in which the ratio G'/G'' of a storage modulus (G') and a loss modulus (G'') at an angular velocity of 0.63 rad/s at 240°C as measured in accordance with JIS K 7244-10, is 0.30-1.00.
Inventors:
NAKANISHI SOICHIRO (JP)
Application Number:
PCT/JP2021/032235
Publication Date:
March 17, 2022
Filing Date:
September 02, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L25/12; C08L35/06; C08L51/04; C08L101/12
Domestic Patent References:
| WO2008026554A1 | 2008-03-06 | |||
| WO2016186133A1 | 2016-11-24 | |||
| WO2010082617A1 | 2010-07-22 |
Foreign References:
| JP2004323772A | 2004-11-18 | |||
| JPH0741624A | 1995-02-10 | |||
| JPH09143319A | 1997-06-03 | |||
| JPH1135760A | 1999-02-09 | |||
| JP2004346148A | 2004-12-09 | |||
| JP2005298774A | 2005-10-27 | |||
| JP2005298776A | 2005-10-27 | |||
| JPS5798536A | 1982-06-18 | |||
| JPS57125242A | 1982-08-04 |
Other References:
See also references of EP 4212584A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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