Title:
HEAT RESISTANT ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/259869
Kind Code:
A1
Abstract:
Provided is a heat resistant adhesive film to be used in a high-temperature heat treatment step wherein said film can be peeled off without leaving adhesive residue on an adherend, even when the adhesive force to the adherend is increased via a high-temperature environment. This adhesive film is obtained by layering a base material, and, on at least one surface of the base material, an easily-adhesive layer and a silicone-based adhesive agent layer, in that order, and is characterized in that the easily-adhesive layer is a cured product obtained by heat curing a composition including: an epoxy compound (A) selected from the group consisting of a cycloalkene oxide type alicyclic epoxy compound (A-i) and a glycidylamine type epoxy compound (A-ii); an acid anhydride (B); and a polyol compound (C).
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Inventors:
SHIMIZU TAKASHI (JP)
Application Number:
PCT/JP2022/021360
Publication Date:
December 15, 2022
Filing Date:
May 25, 2022
Export Citation:
Assignee:
FUJI KAGAKU SHIKOGYO (JP)
International Classes:
B32B27/00; C09J7/38; C09J7/50; C09J11/06; C09J11/08; C09J183/02; C09J183/04
Domestic Patent References:
| WO2021070606A1 | 2021-04-15 |
Foreign References:
| JP2020002203A | 2020-01-09 | |||
| JP2019137741A | 2019-08-22 | |||
| JP2017014308A | 2017-01-19 | |||
| JP2008189736A | 2008-08-21 | |||
| JP2010195862A | 2010-09-09 | |||
| JP2013207177A | 2013-10-07 | |||
| JP2020015864A | 2020-01-30 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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