Title:
HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH
Document Type and Number:
WIPO Patent Application WO/1998/054267
Kind Code:
A1
Abstract:
Heat-resistant adhesives each containing, for example, an amido bond, an imido bond, an ester bond or an ether bond, being insoluble in encapsulant-constituting resins at an encapsulant-molding temperature, and having a shear adhesive strength between a semiconductor chip and a lead frame of at least 1 N/4 mm?2�. They are suitable for the production of heat-resistant resin pastes, and semiconductor chips, lead frames, films, etc. prepared by using the same are suitable for providing semiconductor equipment at a low cost.
Inventors:
SAKATA TOICHI (JP)
NISHIZAWA HIROSHI (JP)
HIRAI KEIZO (JP)
SUZUKI KENJI (JP)
NISHIZAWA HIROSHI (JP)
HIRAI KEIZO (JP)
SUZUKI KENJI (JP)
Application Number:
PCT/JP1998/002361
Publication Date:
December 03, 1998
Filing Date:
May 28, 1998
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
SAKATA TOICHI (JP)
NISHIZAWA HIROSHI (JP)
HIRAI KEIZO (JP)
SUZUKI KENJI (JP)
SAKATA TOICHI (JP)
NISHIZAWA HIROSHI (JP)
HIRAI KEIZO (JP)
SUZUKI KENJI (JP)
International Classes:
C08L79/08; C09J9/00; C08J3/24; C09J179/08; H01L21/52; H01L23/29; H01L23/31; H01L23/495; (IPC1-7): C09J9/00; H01L23/28
Foreign References:
| JPH0940931A | 1997-02-10 | |||
| JPH08245942A | 1996-09-24 | |||
| JPH06322353A | 1994-11-22 | |||
| JPS61136565A | 1986-06-24 |
Other References:
See also references of EP 0984051A4
Attorney, Agent or Firm:
Asamura, Kiyoshi (Room 331 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
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