HEAT-RESISTANT FIBROUS PAPER

Title:

HEAT-RESISTANT FIBROUS PAPER

Document Type and Number:

WIPO Patent Application WO/2002/012619

Kind Code:

A1

Abstract:

A heat-resistant fibrous paper which is formed mainly from short fibers made of a heat-resistant organic polymer, short fibers made of an unstretched or lowly stretched para-aromatic polyamide, and an organic resin binder and/or fibrids made of a heat-resistant organic polymer, wherein the amount of the short fibers is 45 to 97 wt.% based on the whole paper, the amount of the organic resin binder and/or the fibrids is 3 to 55 wt.%, and the organic resin binder has been cured and/or the short fibers of an unstretched or lowly stretched para-aromatic polyamide and the fibrids were partly softened and/or deformed and melted to make them serve as a binder. This heat-resistant fibrous paper is excellent in heat resistance, thermal dimensional stability, interlaminar peel strength, electrical insulating properties in a high-humidity atmosphere, etc. and can be satisfactorily impregnated with a resin despite its high bulk density. It is especially suitable for use as a substrate for electrical insulating materials or a substrate for layered products for electrical circuits.

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Inventors:

MURAYAMA SADAMITSU (JP)
MATSUI MICHIKAGE (JP)
WADA MASANORI (JP)
ISHIHARA SHIGERU (JP)

Application Number:

PCT/JP2000/005259

Publication Date:

February 14, 2002

Filing Date:

August 04, 2000

Export Citation:

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Assignee:

TEIJIN LTD (JP)
MURAYAMA SADAMITSU (JP)
MATSUI MICHIKAGE (JP)
WADA MASANORI (JP)
ISHIHARA SHIGERU (JP)

International Classes:

D04H1/42; D04H1/4334; D04H1/4342; D21H13/26; D04H1/54; D04H1/549; D04H1/58; D04H1/64; H05K1/03; D21H13/24; (IPC1-7): D21H13/26; D04H1/42; H05K1/03

Foreign References:

EP0962559A2

1999-12-08

Other References: