Title:
HEAT-RESISTANT IC TAG
Document Type and Number:
WIPO Patent Application WO/2021/100315
Kind Code:
A1
Abstract:
[Problem] To provide a heat-resistant IC tag having excellent heat insulating property and a long communication distance. [Solution] A heat-resistant IC tag 100 comprises an antenna 200 and an IC module 300. The antenna 200 includes an insulating base material 210 having a first main surface and a second main surface, a first radiating plate 340 provided on the first main surface, a second radiating plate 350 provided on the second main surface, and a conductive member 360 connecting the first radiating plate 340 and the second radiating plate 350; the IC module 300 is electromagnetically coupled to the first radiating plate 340; a holding portion 220 is provided on the insulating base material 210; the IC module 300 is held in a recess 222 formed in the holding portion 220; and a space portion 224 is formed between the inner wall surface of the recess 222 and the outer surface of the IC module 300.
Inventors:
SUGIMURA SHIRO (JP)
Application Number:
PCT/JP2020/036191
Publication Date:
May 27, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
PHOENIX SOLUTION CO LTD (JP)
International Classes:
G06K19/077; H01Q1/38; H01Q7/00; H01Q19/02
Foreign References:
| JP2018041239A | 2018-03-15 | |||
| JP2010204744A | 2010-09-16 | |||
| JP3204483U | 2016-06-02 |
Attorney, Agent or Firm:
CREIA IP ATTORNEYS (JP)
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