HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM

Title:

HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM

Document Type and Number:

WIPO Patent Application WO/1999/010435

Kind Code:

A1

Abstract:

A heat-resistant, lowly dielectric high-molecular material comprising a thermoplastic resin having a multi-layer structure composed of prefereably a non-polar $g(a)-olefinic polymer segment chemically bonded to a vinyl aromatic copolymer segment, wherein a dispersed phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It has an excellent heat resistance, a high strength, a low permittivity suitable for high-frequency electric insulating materials, and a low dielectric loss.

Inventors:

YAMADA TOSHIAKI
TAKAHASHI TAKESHI
YASUKAWA YOSHIYUKI
ENDOU KENJI
ASAMI SHIGERU
YAMADA MICHIHISA
MORIYA YASUO

Application Number:

PCT/JP1998/003764

Publication Date:

March 04, 1999

Filing Date:

August 25, 1998

Export Citation:

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Assignee:

TDK CORP (JP)
NOF CORP (JP)

International Classes:

C08J3/24; B32B27/00; C08F212/08; C08F255/00; C08F255/02; C08J5/18; C08L23/00; C08L23/08; C08L23/20; C08L51/06; C08L53/00; C08L101/02; H01B3/44; H05K1/03; (IPC1-7): C08L101/00; C08F255/00; C08K5/00; C08L23/00; C08L51/06

Foreign References:

JPH05179077A	1993-07-20
JPH0820681A	1996-01-23
JPH03162429A	1991-07-12
JPH01168741A	1989-07-04
JPH08269137A	1996-10-15
JPS6198714A	1986-05-17
JPS61258848A	1986-11-17
JPH06228377A	1994-08-16

Other References: