Title:
HEAT-RESISTANT PACKAGING ADHESIVE FOR HIGH-POWER LED AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/121048
Kind Code:
A1
Abstract:
A heat-resistant packaging adhesive for a high-power LED and a manufacturing method thereof. The adhesive is based on an epoxy resin material and contains an active toughening diluent and an active filler. The adhesive is made under certain process conditions and comprises an epoxy resin, a curing agent, and an accelerator. The epoxy resin selected is a bisphenol-A-type epoxy resin E-51 serving as a matrix resin. A mixture of epoxy resins F-44 and E-51 is used in order to improve the heat- and cold-resistant properties of a product. The F-44 contains at least 2 epoxy groups in the molecular structure thereof and as a result has high reactivity. A cured product of the F-44 has a high crosslink density, a compact structure, and good heat-resistance, mechanical strength and chemical-resistance. Materials, such as a silane coupling agent and the like, that modify and activate the surface of silicon particles are also used. The resultant packaging adhesive has suitable adhesion, longer operable time, and good mechanical processing property and does not break in a high and low temperature shock test.
Inventors:
WANG XINGZHU (CN)
XIAO JUN (CN)
WU WEIPING (CN)
XIAO QIZHEN (CN)
XIAO JUN (CN)
WU WEIPING (CN)
XIAO QIZHEN (CN)
Application Number:
PCT/CN2017/109033
Publication Date:
July 05, 2018
Filing Date:
November 02, 2017
Export Citation:
Assignee:
SUZHOU XING CHUANG YUAN NEW MATERIALS TECH CO LTD (CN)
International Classes:
C09J163/00; C09J11/04; C09J163/02; H01L33/56
Foreign References:
| CN101974302A | 2011-02-16 | |||
| CN105969277A | 2016-09-28 | |||
| CN106010399A | 2016-10-12 | |||
| CN102850988A | 2013-01-02 | |||
| CN102031081A | 2011-04-27 | |||
| CN104672785A | 2015-06-03 | |||
| CN106700997A | 2017-05-24 |
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